Cloud9 Edge Technologies partners with customers to design and develop waterless, pump-free microchannel heat removal systems for high-powered electronics. Here you see our 1U server model and our work station models.
Cloud9 Edge Technologies’s engineers and application specialists provide energy-efficient, environmentally friendly products, solutions and services to meet customers’ needs and exceed their expectations
Please contact us to learn how Cloud9 Edge Technologies systems can help you safely and efficiently cool your high-powered electronics without the use of pumps or water.
Ideal for hardcore PC gamers
High-performance two-phase passive cooling
Ideal for data centers
Isothermal operation prevents heat spikes
Long-term durability and stability
Cuts energy cost by 30%
We have to rewind a little. For years, some will say a decade, Intel dominated AMD in terms of processor speed and calculations per clock cycle. The Intel chips were just so much faster than the AMD lineup. But all that has changed now with the AMD Threadripper series. Every CPU benchmark site since 2019 has them taking top honors over Intel's best offerings. Intel has decided to counter AMD by allowing their chips to be overclocked much higher, but at the cost of generating more heat. Much more heat. So much more, in fact, traditional water cooling solutions do not suffice.
Intel made a special chip, the i9-9900KS, which ran at 5.0 GHz right out of the box. But, it would create temperatures around 94-96 Celsius if running all 8 cores/16 threads using computationally-intense programs. And, you could overclock the chip even higher, as long as you could remove the heat!
But, even a liquid-cooled triple radiator cannot keep an Intel i9-9900KS chip below the temperature of boiling water when running at the higher overclocks of 5.1 GHz or 5.2 GHz. So what other options does one have?
The first step in building a record-smashing server was to create a custom cold plate for contact with the CPU itself. Making it out of pure copper, rather than a nickel-plated one or aluminum, results in nearly twice the thermal conductivity. This allows for more heat to be pulled from the surface of the chip.
Next, staying with the copper strategy, we build a large vapor condenser (because we can't use water in a radiator, remember, the water will boil!) with fins that are nice and thick to increase the surface area of our "radiation." This unit would have to be twice the size if the internal fins were made out of aluminum instead of copper.
This is not just a speed record, it's a heat removal breakthrough as well.
So being the skeptic you rightfully should be, we have provided a comparison speed test challenge. You can match your fastest computer against ours.
So far the fastest computer was able to finish the calculations in 45 minutes…The Nuclear Lighting in 17 minutes!!!!
This was the most advanced liquid cooling tech with the 8-core Intel i9-9900KS chip that can be overclocked to 5.2 GHz.
After doing a remote test I saw that the other liquid cooling tech could not compete with his thermosyphon technology. Heat Flux is conquered!! Our Heat Removal Component can eliminate 500 watts of heat per square Centimeter.